Packaging Central

Packaging Central

Packaging Highlights​ 

OSAT Consolidation Continues (Semiconductor Engineering; May 14, 2018)

Early Chip-Package-System Thermal Analysis (Semiconductor Engineering; May 10, 2018)

Packaging Chips For Cars (Semiconductor Engineering; May 7, 2018)

MIS Packaging Takes Off (Semiconductor Engineering; May 7, 2018)

IFLE 380 IMAPS Device Packaging Conf Part 3: Yole Updates FO-WLP (Solid State Technology; Apr. 25, 2018)

There’s a Fan-out for That (3DInCites; Apr. 24, 2018)

OSAT firms see flip-chip package orders eroded by digital coin price swings (DigiTimes; Apr. 20, 2018)

Semi packaging materials market reaches $16.7bn (ElectronicsWeekly.com; Apr. 19, 2018)

Embedded Die Packaging Emerges (Semiconductor Engineering; Apr. 9, 2018)

TEL Sells Packaging Tool Unit (Semiconductor Engineering; Apr. 4, 2018)

TSMC advanced packaging seen crucial for HPC chips (DigiTimes; Apr. 3, 2018)

China now world’s largest consumer of semiconductor packaging equipment and materials (Solid State Technology; Apr. 2, 2018)

Packaging, Innovation, and Our Application-Driven World (3DInCites; Apr. 2, 2018)

New packaging tech FOPLP rising to spur demand for advanced equipment (DigiTimes; Mar. 28, 2018)

Designing and Integrating MCM/SIP Packages into Systems PCBs (3DInCites; Mar. 26, 2018)

Advanced Packaging Trends – Part II: Solving Lithography Challenges (3DInCites; Mar. 26, 2018)

New Issues In Advanced Packaging (Semiconductor Engineering; Mar. 8, 2018)

Is Advanced Packaging The Next SoC? (Semiconductor Engineering; Mar. 5, 2018)

Toward High-End Fan-Outs (Semiconductor Engineering; Mar. 5, 2018)

Designing and Integrating MCM/SIP Packages into Systems PCBs (3DInCites; Mar. 1, 2018)

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018 (3DInCites; Feb. 23, 2018)

Cheaper Packaging Options Ahead (Semiconductor Engineering; Feb. 5, 2018)

Taiwan IC packagers to cash in on mining craze in 2018 (DigiTimes: Jan. 30, 2018)

Kulicke & Soffa to Participate at SEMICON Korea 2018 (Markets Insider; Jan. 29, 2018)

The Week In Review: Manufacturing (Semiconductor Engineering; Jan. 19, 2018)

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2 (3DInCites; Jan. 15, 2018)

Advanced Packaging Still Not So Simple (Semiconductor Engineering; Jan. 8, 2018)

Packaging Challenges For 2018 (Semiconductor Engineering; Jan. 8, 2018)

Packaging Articles: Archives

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019

      

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May 22-24SEMICON Southeast Asia 2018
July 10-12SEMICON West 2018
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Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)

 

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